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Emerging Smart Robotics Market Opportunities with IEI WAFER-JL-N5105

IEI WAFER-JL takes all the essential elements of the latest Intel® N5105 processor and combines them with smart manufacturing features and proven durability in the compact size 3.5" form factor. It is ideal for space-constrained installations, notably AGVs, AMR (Autonomous Mobile Robot) and small cabinets in factories. It features complete I/O interfaces such as three 2.5 GbE LAN ports for motion control / IPcameras, an M.2 B-key with SIM slot for LTE cellular communication, and USB 3.2 Gen 1, DIO, serial ports for connecting sensors and communicating with other devices.

Quad-Core Intel® Celeron® Processor N5105
IEI WAFER-JL is a 3.5" embedded board equipped with an Intel® Celeron® N5105 quad-core Jasper Lake processor supporting 4 cores, 4 threads, turbo up-to 2.60 GHz with L3 cache, and offering significant IPC (Instruction Per Clock) gains plus 35% performance improvement over the predecessor Gemini Lake based on same base frequency.

Dual Independence Display
It also has Dual Independent Display, to deliver HDMI+DP 4K Resolution for Real-time Monitoring. Running with Intel® UHD Graphics of 11th Gen processor at 800 MHz allows the system to display videos and images in 4K resolution via HDMI 1.4b and DP 1.4 dual independent display. The enhanced visual quality responses the demand of high precision display. The IEL WAFER-JL supports H.265/HEVC (High Efficiency Video Coding) 10-bit decoding/encoding to provide substantially improved video quality and higher bit depth video experience.

Well-design Thermal Solution
IEI has developed a highly efficient thermal solution for the 3.5" motherboard - IEI Heat Conduction Casing (IHCC). With its well-design structure, the IHCC can effectively improve heat transfer performance and cut time-to-market. It is completely joint with CPU for better heat transfer in 0ºC - 60ºC operating temperature. It can be installed on a control cabinet's rear panel, door, or onto a DIN rail. And it is easy to install additional thermal module for operating under high ambient temperatures.

AI Accelerating
With the support of PCI Express 3.0 x2 M.2 SSDs, it is capable of delivering lightning fast data transfer experience for edge AI data process applications compared to the traditional SATA 6Gb/s. The Mustang-M2BM-MX2 card equipped with two Intel® Movidius™ Myriad™ X VPU, providing an flexible AI inference computing.

It delivers triple low-latency 2.5G LAN powered by Intel. The on-board triple Intel® I225V 2.5GbE controllers enable the WAFER-JL to meet the bandwidth-intensive requirements such as large file transfers and high-resolution video streaming. IEI WAFER-JL features unprecedented network connectivity with three rear 2.5 Gigabit LAN ports, and it is small enough to fit into any space confined situations.

High Speed Transmission
The M.2 2230 A key slot carrying with PCIe 3.0 x1 and USB 2.0 signals allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks. The M.2 3042 B key connector supporting PCI Express 3.0 x2 and USB 2.0 signals allows you to use a dedicated 4G LTE radio frequency to ensure secure and delay-free data transmission in smart manufacturing.

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